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News
Issue #2002 - 44
(November 2002)
(Updated Nov.
20, 2002)
TECHNOLOGY
QUALCOMM Licenses USB On-The-Go
Technology from TransDimension for 3G Chipsets
— USB OTG Technology Allows Wireless
Terminals to Connect Directly to Accessories such as Printers,
Cameras, Keyboards, Audio Players and CD-ROMs —
San Diego and
Irvine, California — November 11, 2002 — QUALCOMM
Incorporated (Nasdaq: QCOM), pioneer and world leader of Code
Division Multiple Access (CDMA) digital wireless technology, and
TransDimension, a privately held company that develops and markets
connectivity solutions based on Universal Serial Bus (USB) and
Bluetooth™ technologies, today announced the licensing by QUALCOMM
of TransDimension’s USB On-The-Go (OTG) technology.
USB is a serial interface that allows communication between hosts
such as PCs and peripherals. As more portable devices adopt the USB
interface, direct connectivity — without a PC as an intermediary
— has become a necessity. The OTG Supplement to the USB 2.0
Specification defines several enhancements that address the growing
need for mobile connectivity, including a USB peripheral with host
capability to communicate with other selected USB peripherals, a
mobile-form-factor USB connector, and low-power capabilities to
preserve battery life. Wireless handsets using QUALCOMM chipsets
that incorporate the OTG technology will enable access to a
multitude of existing USB devices — including accessories such as
printers, digital cameras, keyboards, audio players and CD-ROMs.
“QUALCOMM is committed to providing our customers with the most
cost-effective and highly integrated 3G wireless solutions in the
industry,” said Don Schrock, president of QUALCOMM CDMA
Technologies. “Partnering with TransDimension and integrating its
complete OTG solution into QUALCOMM products will enable a new
generation of connectivity between leading-edge third-generation
(3G) wireless terminals and numerous USB devices.”
“We are proud QUALCOMM has chosen our technology to bring
innovative new connectivity features like OTG to their
next-generation chipsets,” said Rick Goerner, CEO of
TransDimension. “We were able to offer the industry’s most
complete OTG solution, consisting of our USB OTG Controller IP Core,
USBLink OTG software and class drivers, and we are pleased that
QUALCOMM is making it part of their overall connectivity
solution.”
About TransDimension
Headquartered in Irvine, Calif., TransDimension is a privately held
company founded in 1997 to develop and market embedded and mobile
connectivity solutions based on intelligent USB and Bluetooth™
technologies. SoftConnex, an independent subsidiary of
TransDimension, delivers a complete software solution for the USB
embedded market.
For more information: http://www.transdimension.com
and http://www.softconnex.com.
MobileInfo Comments and Advisory: Support
of USB On-the-Go by Qualcomm and incorporation of this functionality
in its future chipset MSM6500 will enable new breed of phones to
exchange information directly with any device supporting USB port
i.e. printer, digital camera, or keyboard. Therefore, it opens up
many possibilities. This brings the PC architecture and cellular
phone architecture closer together and that is a good technical
initiative towards convergence of two architectures.
Note: This news release may contain
forward-looking statements within the meaning of section 27A of the
Securities Act of 1933 and section 21E of Securities Exchange act of
1934 in USA. Similar provisions exist in other countries. There is no
assurance that the stipulated plans of vendors will be implemented.
MobileInfo does not warrant the authenticity of the information.
Readers should take appropriate caution in developing plans utilizing
these products, services and technology architectures. All
trademarks used in this summary are the property of their respective
owners.
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